? semiconductor components industries, llc, 2006 january, 2006 ? rev. 8 1 publication order number: mc12026a/d mc12026a 1.1 ghz dual modulus prescaler description the mc12026 is a high frequency, low voltage dual modulus prescaler used in phase ? locked loop (pll) applications. the mc12026a can be used with cmos synthesizers requiring positive edges to trigger internal counters in a pll to provide tuning signals up to 1.1 ghz in programmable frequency steps. a divide ratio control (sw) permits selection of an 8/9 or 16/17 divide ratio as desired. the modulus control (mc) selects the proper divide number after sw has been biased to select the desired divide ratio. features ? 1.1 ghz toggle frequency ? supply voltage 4.5 to 5.5 v ? low power 4.0 ma typical ? operating temperature range of ? 40 to 85 c ? the mc12026 is pin compatible with the mc12022 ? short setup time (t set ) 6.0 ns typical @ 1.1 ghz ? modulus control input level is compatible with standard cmos and ttl ? pb ? free packages are available table 1. functional table sw mc divide ratio h h 8 h l 9 l h 16 l l 17 1. sw: h = v cc , l = open. a logic l can also be applied by grounding this pin, but this is not recommended due to increased power consumption. 2. mc: h = 2.0 v to v cc , l = gnd to 0.8 v. table 2. maximum ratings characteristics symbol value unit power supply voltage, pin 2 v cc ? 0.5 to 7.0 vdc operating temperature range t a ? 40 to 85 c storage temperature range t stg ? 65 to 150 c modulus control input, pin 6 mc ? 0.5 to 6.5 vdc maximum output current, pin 4 i o 10.0 ma maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. note: esd data available upon request. http://onsemi.com pin connections (top view) in 8 in v cc sw out nc mc gnd 7 6 5 1 2 3 4 soic ? 8 d suffix case 751 marking diagram a = assembly location l = wafer lot y = year w = work week = pb ? free package 1 8 026a alyw 1 8 see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information
mc12026a http://onsemi.com 2 table 3. electrical characteristics (v cc = 4.5 to 5.5; t a = ? 40 to 85 c, unless otherwise noted.) characteristic symbol min typ max unit toggle frequency (sin wave) f t 0.1 1.4 1.1 ghz supply current output unloaded (pin 2) i cc ? 4.0 5.3 ma modulus control input high (mc) v ih1 2.0 ? v cc v modulus control input low (mc) v il1 gnd ? 0.8 v divide ratio control input high (sw) v ih2 v cc ? 0.5 v v cc v cc + 0.5 v v divide ratio control input low (sw) v il2 open open open ? output voltage swing (r l = 560 ; i o = 5.5 ma) (note 3) (r l = 1.1 k ; i o = 2.9 ma) (note 4) v out 1.0 1.6 ? v pp modulus setup time mc to out (note 5) t set ? 6.0 9.0 ns input voltage sensitivity 100 ? 250 mhz 250 ? 1100 mhz v in 400 100 ? ? 1000 1000 mvpp 3. divide ratio of 8/9 at 1.1 ghz, c l = 8.0 pf. 4. divide ratio of 16/17 at 1.1 ghz, c l = 8.0 pf. 5. assuming r l = 560 at 1.1 ghz. dq cqb dq cqb dq c qb m in in mc d c qb q d c qb q out figure 1. logic diagram (mc12026a) 1 0 sw figure 2. modulus setup time modulus setup time mc to out is the mc setup or mc release plus the prop delay. prop. delay in out mc mc setup mc release
mc12026a http://onsemi.com 3 figure 3. ac test circuit sine wave generator 50 c1 c2 mc input c3 v cc = 4.5 to 5.5v c l r l v cc sw in in mc gnd out external components c1 = c2 = 1000 pf c3 = 0.1 f c l = 8pf (including scope and jig capacitance) r l = 560 (for 8/9 at 1.1ghz) figure 4. input signal amplitude versus input frequency +15.0 +10.0 +5.0 0 ?5.0 ?10.0 ?15.0 ?20.0 ?25.0 ?30.0 ?35.0 ?40.0 ?45.0 ?50.0 +1257.40 +0.71 +1.26 +2.24 +3.98 +7.07 +12.57 +22.36 +39.76 +70.71 +125.74 +223.61 +397.64 +707.11 0 200 400 600 800 1000 1200 1400 1600 1800 frequency (mhz) amplitude (dbm) mvrms frequency (mhz) 0 400 800 1200 1600 2000 mvpp figure 5. output amplitude versus input frequency operating window divide ratio = 8; v cc = 5.0 v; t a = 25 c
mc12026a http://onsemi.com 4 figure 6. typical output waveform 880mv 36.6ns 86.6ns 5.88v ( 8, 1.1 ghz input frequency, v cc = 5.0, t a = 25 c, output loaded with 8.0pf)
mc12026a http://onsemi.com 5 ? 650 ? 600 ? 550 ? 500 ? 450 ? 400 ? 350 ? 300 ? 250 ? 200 ? 150 ? 100 ? 50 0 50 100 150 200 100 200 300 400 500 600 700 800 900 1000 1100 1200 figure 7. typical input impedance versus input frequency mhz ohms jx r ordering information device package shipping ? mc12026ad soic ? 8 98 units / rail MC12026ADG soic ? 8 (pb ? free) 98 units / rail mc12026adr2 soic ? 8 2500 / tape & reel mc12026adr2g soic ? 8 (pb ? free) 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc12026a http://onsemi.com 6 package dimensions soic ? 8 nb case 751 ? 07 issue ag seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 mc12026a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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